date:Jul 14, 2012
Oslo-based Thin Film Electronics will provideprinted electronics technology in the form of sensor labelsthat can collect and wirelessly communicate sensor information such as humidity, temperature and environmental factors affectingpackaging from manufacture to commercial scale.
Bemis originally plans to use the label sensors on the outside of the packaging but believe it might be possible to use them on the inside sometime in the future.
The firm said it made the move to take advantage of the